data sheet doc. no : qw0905-lur 2043/tbs-x rev. : a date : 23 - mar. - 2005 ligitek electronics co.,ltd. property of ligitek only tape and box round t ype led lamps lur2043/tbs-x
lur2043 note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 25.0min 1.0min 2.54typ ?? 0.5 typ 4.2 5.2 1.5max 4.0 3.0 t part no. package dimensions 1/5 page lur2043/tbs-x p2 h2 h1 w2 w1 w3 p1 p d f w0 l g h ligitek electronics co.,ltd. property of ligitek only
storage temperature tstg -40 ~ +100 j red note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. typical electrical & optical characteristics (ta=25 j ) emitted material part no lur2043/tbs-x gaalas soldering temperature spectral halfwidth ??f nm peak wave length f pnm viewing angle 2 c 1/2 (deg) min. water clear lens 660 20 900 typ. max. 1.5 2.4 550 min. 30 max 260 j for 5 sec max (2mm from body) forward voltage @20ma(v) color tsol luminous intensity @20ma(mcd) absolute maximum ratings at ta=25 j part no. lur2043/tbs-x forward current peak forward current duty 1/10@10khz power dissipation reverse current @5v operating temperature parameter page 2/5 ur 10 120 120 40 -40 ~ +85 ratings i f t opr ir pd i fp symbol ma j g a mw ma unit ligitek electronics co.,ltd. property of ligitek only
0.79 0.75 19.0 trs-9 20.0 symbol minimum maxmum description quantity/box 2500pcs overall length l 330 13.0 340 mm inch mm 13.4 inch remark:tbs=tape and box straight leads dimensions symbol information ?e specification tape width adhesive t ape width adhesive tape position ------- ------- ------- package dimensions ?e w3 17.5 0.69 w2 0 w1 14.5 0 0.57 0.75 19.0 0.61 0.16 4.0 15.5 overall taped pack age thickness center of component location feed hole location lead location ------- ------- ------- ------- lead length after com ponent height feed hole to overall com ponent height feed hole pitch ------- ------- ------- trs-10 w0 8.5 t ------- 0.33 ------- p2 5.1 p1 4.4 0.2 0.17 0.06 0.38 9.75 1.42 0.23 0.3 7.7 5.8 p 12.4 l 0.49 w0 h2 ------- 18.4 ------- 0.72 0.43 0.51 13.0 11.0 1.42 0.76 36 19.4 3/5 page part no. lur2043/tbs-x trs-4 feed hole to bottom of com ponent trs-7 trs-8 trs-6 trs-5 front-to-rear deflection trs-2 trs-3 trs-1 ------- 1.12 1.08 28.5 27.5 24.0 0.94 24.5 0.96 h1 19.9 22.5 0.78 0.89 0.98 25.0 1.0 25.5 0.82 0.93 20.9 23.5 21.5 0.85 25.5 1.0 17.5 ? h ------- 0.69 ------- 0.89 22.5 1.04 26.5 0.08 0.73 18.5 2.0 symbol symbol items option code tape feed hole diameter component lead pitch ------- ------- dimensions symbol information ?e maximum minimum f2.3 d3.8 0.09 0.15 mm inch 0.17 0.12 3.0 4.2 inch mm specifications ligitek electronics co.,ltd. property of ligitek only l w h overall width w 265 10.4 275 10.8 overall thickness h50 60 1.97 2.4
ligitek electronics co.,ltd. property of ligitek only 0.0 0.8 forward voltage@20ma normalize @25 j relative intensity@20ma normalize @25 j wavelength (nm) ambient temperature( j ) fig.5 relative intensity vs. wavelength relative intensity@20ma 1.0 0.0 600 0.5 -40 -20 650 700 750 -40 80 20 04060100 ambient temperature( j ) -20 0 40 20 100 80 60 1 forward current(ma) relative intensity normalize @20ma fig.3 forward voltage vs. temperature 0.9 1.0 1.1 1.2 0 1 1.0 1.0 0.5 1.5 2.0 2.5 3.0 1 fig.4 relative intensity vs. temperature forward voltage(v) 3.0 2.0 4.0 0.0 5.0 0.5 forward current(ma) 100 10 1000 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 10 100 1000 ur chip fig.2 relative intensity vs. forward current 2.5 1.5 1.0 2.0 3.0 part no. lur2043/tbs-x page 4/5 25% 75% 100% 50% 50% 0 25% 75% 100% -60 x -60 x fig.6 directivity radiation -30 x 30 x 0 x
thermal shock test solder resistance test solderability test high temperature high humidity test mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202:103b jis c 7021: b-11 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hous. 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.ta=65 j? 5 j 2.rh=90 %~95 % 3.t=240hrs ? 2hrs part no. lur2043/tbs-x low temperature storage test test item operating life test high temperature storage test reliability test: jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reference standard ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) test condition this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. description page 5/5
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